Thermalright LGA1700 BCF

Thermalright LGA1700-BCF Anti-Bending CPU Frame Instruction Manual

Model: LGA1700 BCF

1. Koniec produktuview

The Thermalright LGA1700-BCF is a specialized anti-bending fastener designed for Intel 12th, 13th, and 14th generation CPUs. Its primary function is to correct and prevent CPU bending, which can occur with standard motherboard Integrated Loading Mechanisms (ILM). By providing even pressure distribution across the CPU's Integrated Heat Spreader (IHS), it ensures optimal contact with your CPU cooler, leading to improved thermal performance and enhanced long-term CPU integrity.

Thermalright LGA1700-BCF Anti-Bending CPU Frame

Image 1.1: Thermalright LGA1700-BCF Anti-Bending CPU Frame. This image displays the black aluminum alloy frame designed to fit around an Intel LGA1700 CPU.

2. Główne cechy

  • Zaawansowana technologia: Constructed from aluminum alloy using CNC manufacturing and anodized sandblasting, ensuring precise fitment and avoidance of capacitors.
  • Optymalny projekt: Carefully engineered to fit the CPU and support the weight of the cooler, preventing CPU bending.
  • Insulation Foot Pads: Utilizes LOTES original specification insulation protection feet for even pressure distribution, preventing wear on the CPU cover during multiple installations.
  • Szeroka kompatybilność: Supports Intel 12th, 13th, and 14th generation CPUs, and motherboards with LGA1700 chipsets including H610, B660, Z690, and Z790 series.
  • Łatwa instalacja: Includes an L-shaped screwdriver for straightforward installation. Video guidance is recommended for a successful first-time setup.
Thermalright LGA1700-BCF with Insulated Protective Film

Image 2.1: Close-up of the LGA1700-BCF showing the insulated protective film on the back, designed to prevent damage to the CPU or motherboard.

Thermalright LGA1700-BCF Newer vs Older Version

Image 2.2: Comparison of the newer and older versions of the LGA1700-BCF, both supporting Intel 12th and 13th generation CPUs. Both versions may be shipped randomly.

3. Konfiguracja i instalacja

Follow these steps carefully to install the Thermalright LGA1700-BCF Anti-Bending CPU Frame. It is highly recommended to watch the official installation video for visual guidance.

3.1. Kroki przed instalacją

  1. Place your motherboard on a flat, non-conductive, and level surface.
  2. Ensure your Intel LGA1700 CPU is already installed in its socket.
  3. Open the motherboard's Integrated Loading Mechanism (ILM) lever.

3.2. Usuwanie oryginalnego ILM

  1. Using the included L-shaped screwdriver, carefully unscrew the four screws that secure the original ILM to the motherboard. Keep the CPU in the socket during this process.
  2. Remove the original ILM. Keep the screws and the socket backplate, as these will be reused.

Video 3.1: Official Thermalright LGA1700-BCF Series Installation Guide. This video provides a step-by-step visual demonstration of the installation process for the anti-bending frame.

3.3. Installing the LGA1700-BCF

  1. Place the Thermalright LGA1700-BCF frame over the CPU, ensuring the mounting holes on the frame align with the socket backplate.
  2. Use the original screws that were removed from the ILM to secure the BCF.
  3. Tighten the screws gradually in a cross-pattern (e.g., top-left, bottom-right, top-right, bottom-left) to apply optimal and even mounting pressure. Do not overtighten.
Thermalright LGA1700-BCF Installation Process

Image 3.1: Visual guide showing the four steps of the installation process: 1. CPU in socket, 2. Original ILM, 3. Placing BCF, 4. BCF secured.

Thermalright LGA1700-BCF Installed on Motherboard

Image 3.2: The LGA1700-BCF frame correctly installed around the CPU on a motherboard, with screws tightened.

3.4. Po instalacji

  1. If not already applied to your CPU cooler, apply a thin, even layer of thermal paste to the CPU's Integrated Heat Spreader (IHS).
  2. Zainstaluj chłodzenie procesora zgodnie z instrukcją producenta.

4. Zasady działania

The Thermalright LGA1700-BCF is a passive component that works by replacing the motherboard's stock ILM. The standard ILM can apply uneven pressure to the CPU, causing it to bend slightly (concave). This bending can lead to suboptimal contact between the CPU and the cooler, resulting in higher temperatures. The BCF frame is designed to apply uniform pressure across the CPU's surface, preventing bending and ensuring a flat, consistent contact area for your CPU cooler. This optimized contact improves heat transfer efficiency and contributes to lower operating temperatures and increased CPU longevity.

5. Konserwacja

The LGA1700-BCF requires minimal maintenance once installed correctly.

  • Usuwanie kurzu: Periodically inspect the area around the CPU socket and the BCF for dust accumulation. Use compressed air or a soft brush to gently remove any dust.
  • Kontrola śrub: After initial installation and after any significant movement of the PC, it is advisable to gently check the tightness of the four mounting screws. Ensure they are snug but do not overtighten, as this can cause damage.
  • Unikaj płynów: Keep liquids away from the motherboard and CPU area to prevent short circuits or corrosion.

6. Rozwiązywanie Problemów

If you encounter issues after installing the Thermalright LGA1700-BCF, consider the following:

  • CPU Not Recognized / System Not Booting:
    • Ensure the CPU is correctly seated in the socket before installing the BCF.
    • Verify that the BCF is installed correctly and not interfering with any motherboard components or CPU pins.
    • Recheck all power connections to the motherboard and CPU.
  • Wysokie temperatury procesora:
    • Confirm that the BCF screws are tightened evenly in a cross-pattern to ensure optimal mounting pressure.
    • Verify that thermal paste was applied correctly and evenly between the CPU IHS and the cooler base.
    • Ensure your CPU cooler is properly installed and making full contact with the CPU.
  • Physical Damage to CPU or Motherboard:
    • During installation, avoid excessive force. The screws should be tightened until snug, not overtightened.
    • Carefully inspect the CPU pins and motherboard socket for any signs of damage if issues persist.

If troubleshooting steps do not resolve the issue, consider reviewing the installation video again or consulting a qualified technician.

7. Specyfikacje

Detailed specifications for the Thermalright LGA1700-BCF Anti-Bending CPU Frame:

Nazwa produktuThermalright LGA1700-BCF Anti-Bending CPU Frame
Numer modeluLGA1700 BCF
Wymiary (dł. x szer. x wys.)70 mm x 54 mm x 6 mm (2.76" dł. x 0.24" szer. x 2.13" wys.)
TworzywoStop aluminium
Waga przedmiotu0.317 uncji (około 9 g)
Kompatybilność procesoraIntel 12th, 13th, 14th Generation CPUs (LGA1700 Socket)
Motherboard Chipset CompatibilityH610, B660, Z690, Z790 series
Dołączone akcesoriaL-shaped screwdriver
Thermalright LGA1700-BCF Dimensions

Image 7.1: Diagram illustrating the dimensions of the LGA1700-BCF frame, showing its length, width, and height.

8. Gwarancja i wsparcie

For specific warranty information regarding your Thermalright LGA1700-BCF Anti-Bending CPU Frame, please refer to the documentation included with your purchase or visit the official Thermalright website. For technical support, product inquiries, or assistance with installation, please contact Thermalright customer service or your authorized retailer.

Video 8.1: Thermalright LGA1700-BCF Product Overview. This video provides additional details and visual context for the anti-bending frame.

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