Infiray Mini2 640

Infiray Mini2 640 Thermal Imaging Camera Module User Manual

Model: Mini2 640

1. Wprowadzenie

The Infiray Infisense Mini2 640X512 module is an advanced uncooled thermal imaging camera. It utilizes a high frame rate 12µm WLP package detector and the second-generation self-developed infrared ISP chip (LY Series). This module is designed with high performance, small volume, light weight, low power consumption, and low cost, meeting the SWaP (size, weight, and power/price) application requirements.

The Infiray Infisense Mini2 640X512 Uncooled Infrared Module features a shutter-less algorithm, ensuring smooth and stutter-free image display. It incorporates a new generation infrared dedicated image algorithm, generating delicate and clear thermal images. The module offers multiple digital interfaces, allowing flexible integration with various intelligent processing platforms.

Główne cechy:

  • High frame rate for dynamic thermal capture.
  • Standard shutter-less algorithm for continuous, smooth imaging.
  • High quality image display with clear thermal details.
  • Optimized cost performance for a wide range of applications.

Scenariusze zastosowań:

  • UAV Search: Ideal for photoelectric pods in unmanned aerial vehicles.
  • Portable Terminals: Suitable for outdoor handheld devices and helmet-mounted night vision systems.
  • Security/Fire Inspection: Applicable in industrial monitoring, perimeter scanning, inspection robots, fire warning systems, and fire helmets.
  • Intelligent Integration: Can be integrated into assisted driving systems and smart home appliances.

2. Koniec produktuview

Infiray Mini2 640 Thermal Imaging Camera Module front view

Rycina 2.1: Przód view of the Infiray Mini2 640 module.

Infiray Mini2 640 Thermal Imaging Camera Module held in hand

Figure 2.2: The compact Infiray Mini2 640 module held in a gloved hand, showcasing its small size.

Video 2.1: A demonstration of the Infiray Mini2 640X512 9mm Lens MIPI Interface, showcasing the uncooled LWIR infrared thermal camera designed for FPV drone use.

3. Konfiguracja i połączenia

The Mini2 640 module is designed for integration into host systems. Proper connection of power, data, and video interfaces is crucial for its operation. Refer to the diagrams and tables below for detailed pin definitions and accessory descriptions.

3.1 Accessories and Cables

Table describing accessories and cables for the thermal camera module, including FPC cables, USB board, and Type-C data cable.

Figure 3.1: Accessories and Cables Description. This table details various connection components such as FPC cables (50pin to 50pin, 50pin to connecting finger), a USB board for USB2.0 graphing, analog video, serial communication, and USB power, and a Type-C data cable for analog video and serial communication.

3.2 HIROSE50 Pin Definition

The module uses a 50PIN male connector (model: DF40C-50DP-0.4V(51)). The following table and diagrams provide the pin definitions and layout for proper electrical connection.

Table detailing HIROSE50 Pin Definition with pin numbers, names, types, and revision content.

Figure 3.2: HIROSE50 Pin Definition. This table lists pin numbers, names (e.g., DVP_CLK, DVP_VSYNC, MIPI_D0_P/N, USB_DP, PAL_OUT, UART0_TX, I2C_SLV_SCK, NRST, VDD5.0, VDD3.3, DGND, NC), their respective output/input types, and revision content (e.g., DVP data signal, MIPI data signal, Analog output signal, Universal asynchronous receiver/transmitter pins, I2C slave clock/data, Reset, Power supply, Ground).

  • NOTE 1: The order of pin numbers and pin names in the table is consistent.
  • NOTE 2: The default voltage for DVP and IIC slave is 1.8V, which can be switched to 3.3V by command.
  • NOTE 3: The default voltage for UART0, UART1, and IIC master is 3.3V and cannot be switched.
  • NOTE 4: The hardware description here is only for product selection reference. Please contact our technicians for detailed hardware development information during specific development.
  • NOTE 5: CVBS only supports black-hot/white-hot switching.
Diagrams showing HIROSE50 Pinout Diagram A and B, illustrating the physical layout of the 50-pin connector.

Figure 3.3: Interfaces and Accessories, HIROSE50 Pinout Diagram A and B. These diagrams provide a visual representation of the 50PIN male connector (DF40C-50DP-0.4V(51)) and its pin assignments, crucial for correct wiring and integration.

4. Działanie

The Infiray Mini2 640 module is designed as a component for integration into larger systems. Its operation is typically controlled by the host platform it is connected to. The module provides raw thermal data or processed video streams via its digital and analog interfaces.

4.1 Image Adjustment Features

The module supports several image adjustment features, which can typically be controlled via the communication interface (e.g., UART, I2C) by the host system:

  • Non-uniformity Correction: Utilizes a shutter-correction/shutter-less algorithm for consistent image quality.
  • Regulacja jasności/kontrastu: Adjustable from 0 to 100 (optional).
  • Polarity/Palette: Supports White-hot, Black-hot, and various other palettes.
  • Zoom cyfrowy: Continuous zoom from 1.0x to 8.0x (step size: 0.1).
  • Image Mirroring: Vertical/Horizontal/Diagonal mirroring options.

For detailed control commands and software integration, please refer to the specific SDK and API documentation provided by Infiray for developers.

5. Konserwacja

To ensure optimal performance and longevity of your Infiray Mini2 640 module, follow these general maintenance guidelines:

  • Czyszczenie: Gently clean the lens and module exterior with a soft, lint-free cloth. Avoid abrasive materials or harsh chemicals. For stubborn dirt on the lens, use a lens cleaning solution specifically designed for optical components.
  • Obsługiwanie: Handle the module with care. Avoid dropping it or subjecting it to strong impacts. When connecting cables, ensure proper alignment to prevent damage to the connectors.
  • Składowanie: Store the module in a dry, dust-free environment within the specified storage temperature range (-50°C to +85°C) and humidity (5%-95%, non-condensing).
  • Ochrona środowiska: While the module is designed for various environments, protect it from extreme conditions beyond its operating limits, such as direct exposure to corrosive substances or excessive moisture.

6. Rozwiązywanie Problemów

This section provides general troubleshooting tips. For complex issues, it is recommended to consult the Infiray technical support or the documentation for your specific host system integration.

ProblemMożliwa przyczynaRozwiązanie
Brak obrazu wyjściowego
  • Nieprawidłowe zasilanie.
  • Loose or incorrect data cable connection.
  • Host system not configured correctly.
  • Sprawdź napięcie zasilaniatage (5V) and current.
  • Check all cable connections (FPC, USB, CVBS) for secure and correct insertion.
  • Ensure the host system's software/hardware is properly configured to receive data from the module.
Poor image quality (blurry, noisy)
  • Obiektyw jest brudny.
  • Incorrect image adjustment settings.
  • Zakłócenia środowiska.
  • Clean the lens carefully.
  • Adjust brightness, contrast, and palette settings via the host system.
  • Ensure the module is operating within its specified environmental conditions.
Module not recognized by host system
  • Driver issues (for USB).
  • Incorrect communication protocol settings (UART, I2C).
  • Install necessary drivers for USB communication.
  • Verify communication settings (baud rate, address) match the host system's configuration.

7. Specyfikacje

7.1 Specyfikacje techniczne

Table of Technical Specifications for the Infiray Mini2 thermal camera module, including detector type, resolution, frame rate, pixel pitch, spectral band, NETD, thermal time constant, image adjustments, electrical parameters, physical characteristics, and environmental adaptability.

Figure 7.1: Technical Specifications. This table provides detailed information on the module's performance and characteristics, including detector type (Vanadium Oxide Uncooled Infrared Focal Plane Detector), resolution options (256x192, 384x288, 640x512), effective frame rate, pixel pitch (12µm), spectral band (8-14µm), NETD, thermal time constant, image adjustment features, electrical parameters (5V power supply, typical power consumption), physical characteristics (weight, dimensions), and environmental adaptability (operating/storage temperature, humidity, vibration, impact).

7.2 Lens Parameters (Table 2-3 from image)

Table of Lens Parameters for various lens codes, including focal length, F-number, IFOV, focus range, detection distance, recognition distance, identification distance, and weight.

Figure 7.2: Lens Parameters. This table (Table 2-3) outlines the specifications for different lens options, including Lens Code, Focal Length (mm), F-number, IFOV, Focus range, Detection Distance, Recognition Distance, Identification Distance, and Weight (Lens and Flange).

8. Gwarancja i wsparcie

For warranty information, technical support, or service inquiries, please contact your point of purchase or the official Infiray support channels. Ensure you have your product model and any relevant purchase details available when seeking support.

9. Wskazówki użytkownika

Chociaż nie ma konkretnego użytkownikaviews or Q&A were provided, general tips for thermal imaging modules include:

  • Integration Planning: Thoroughly plan your integration with the host system, considering power requirements, data interfaces, and physical mounting.
  • Rozwój oprogramowania: If developing custom software, leverage the provided SDKs and documentation for efficient integration and control of module features.
  • Zagadnienia dotyczące ochrony środowiska: Be mindful of the operating environment. Extreme temperatures or high humidity can affect performance.
  • Kalibrowanie: Understand if and when calibration (e.g., NUC - Non-Uniformity Correction) is performed automatically or if manual triggers are available/necessary for optimal image quality in varying conditions.

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